Search   Keyword Search
 

SOLDER JOIN RELIABILITY OF BGA, CSP, FLIP CHIP, AND FINE PITCH SMT ASSEMBIES
by LAU, JOHN H;PAO, YI HSIN

List Price: HK$ 617.50

Quantity :

¡@ISBN 9780070366480
¡@Subject ENGINEERING
¡@Publisher MH
¡@Publication 1997
¡@Edition Hardcover
¡@Version Original
¡@Description
 
    Home
    Upcoming Events
    Special Offer
    Kobo eReader
    My Account
    View Cart
    Order History
    Recommendation
    Of The Month
    Textbooks
    About Us
    Contact Us
    FAQs