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CHIP SCALE PACKAGING: DESIGN, MATERIALS, PROCESS, RELIABILITY, AND APPLICATIONS
by LAU, JOHN H.;LEE, S. W. RICKY

List Price: HK$ 850.00

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¡@ISBN 9780070383043
¡@Subject SCIENTIFIC & TECHNICAL
¡@Publisher MCGRAW-HILL
¡@Publication 1999
¡@Edition Hardcover
¡@Version Original
¡@Description
 
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