Search   Keyword Search
 
Page : 1
Search Result
CHIP SCALE PACKAGING: DESIGN, MATERIALS, PROCESS, RELIABILITY, AND APPLICATIONS by LAU, JOHN H. (Hardcover - 1999)
ISBN: 9780070383043
Subject: SCIENTIFIC & TECHNICAL
Publisher: MCGRAW-HILL
LOW COST FLIP CHIP TECHNOLOGIES FOR DCA, WLCSP, AND PBGA ASSEMBLIES by LAU, JOHN H. (Hardcover - 2000)
ISBN: 9780071183659
Subject: SCIENTIFIC & TECHNICAL
Publisher: MCGRAW-HILL
   
    Home
    Upcoming Events
    Special Offer
    Kobo eReader
    My Account
    View Cart
    Order History
    Recommendation
    Of The Month
    Textbooks
    About Us
    Contact Us
    FAQs